Irreversibility analysis on a radiative hybrid nanofluid flow across an exponentially stretching sheet with multiple slips and variable thermal conductivity

Rajesh Chary Kandukoori,Pranitha Janapatla,Anomitra Chakraborty
DOI: https://doi.org/10.1177/09544089241276350
2024-09-05
Proceedings of the Institution of Mechanical Engineers Part E Journal of Process Mechanical Engineering
Abstract:Proceedings of the Institution of Mechanical Engineers, Part E: Journal of Process Mechanical Engineering, Ahead of Print. The entropy analysis and flow behavior of a mixed convective hybrid nanofluid [math] across an exponentially stretching sheet were examined in this article using Tiwari-Das model in presence of thermal radiation, Joule heating, viscous dissipation, velocity slip, and thermal slip at the boundary with the idea of variable thermal conductivity which was yet to be studied by any researcher. This attests to the novelty of our study. The non-linear partial differential equations have been transformed into non-dimensional ordinary differential equations using similarity transformations, and the MATLAB bvp4c algorithm is used to solve it numerically. Comparisons were made with previously published studies which were found to be in great agreement. The temperature profile increases with increasing Eckert number [math], variable thermal conductivity parameter [math], buoyancy parameter [math], volume fraction of nanoparticle parameter [math], and radiation parameter [math]. However, the opposite trend is observed when suction parameter [math] is increased. It was observed that the fluid motion decreases as velocity slip [math] increases and thermal slip [math] behaves in the same manner on temperature profile. It is observed that, for differing values of Eckert number and radiation parameter, the skin friction coefficient leads to increase while the Nusselt number values decrease. An increased by 9.39% is observed for entropy production [math] for a change in Brinkmann number [math] from 0.5 to 2.0 while entropy production profile reduced by [math] for changing the variable thermal conductivity parameter from [math] to 1.5. Similarly, an increased by [math] is observed for temperature profile for a change in radiation parameter from Rd = 0.10 to 1.50. The current study discovered use for it in glass fiber production, wire drawing stretching, aerodynamic plastic sheet extrusion, metallic plate cooling, etc.
engineering, mechanical
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