High‐Performance and Flexible Co‐Planar Integrated Microsystem of Carbon‐Based All‐Solid‐State Micro‐Supercapacitor and Real‐Time Temperature Sensor

Dongming Liu,Jiaxin Ma,Shuanghao Zheng,Wenlong Shao,Tianpeng Zhang,Siyang Liu,Xigao Jian,Zhong‐Shuai Wu,Fangyuan Hu
DOI: https://doi.org/10.1002/eem2.12445
2022-06-02
Abstract:With the rapid development of flexible and portable microelectronics, the extreme demand for miniaturized, mechanically flexible and integrated microsystems is strongly stimulated. Here, biomass‐derived carbon (BDC) is prepared by KOH activation using Qamgur precursor, exhibiting three‐dimensional hierarchical porous structure. Benefiting from unobstructed three‐dimensional hierarchical porous structure, BDC provides an excellent specific capacitance of 433 F/g and prominent cyclability without capacitance degradation after 50000 cycles at 50 A/g. Furthermore, a BDC‐based planar micro‐supercapacitor (MSC) without metal collector, prepared by mask‐assisted coating, exhibits outstanding areal specific capacitance of 84 mF/cm2, and areal energy density of 10.6 μWh/cm2, exceeding most of the previous carbon‐based MSCs. Impressively, the MSCs discloses extraordinary flexibility with capacitance retention of almost 100% under extreme bending state. More importantly, a flexible planar integrated system composed of the MSC and temperature sensor is assembled to efficiently monitor the temperature variation, providing a feasible route for flexible MSC‐based functional micro‐devices.
materials science, multidisciplinary
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