Dual mechanisms in hydrogen reduction of copper oxide: surface reaction and subsurface oxygen atom transfer

Yehan Wu,Ruixue Fang,Laihong Shen,Hongcun Bai
DOI: https://doi.org/10.1039/d4ra01240b
IF: 4.036
2024-03-27
RSC Advances
Abstract:The study of the reduction of copper oxide (CuO) by hydrogen (H 2 ) is helpful in elucidating the reduction mechanism of oxygen carriers. In this study, the reduction mechanism of CuO by H 2 and the process of oxygen atom transfer were investigated through the density functional theory (DFT) method and thermodynamic calculation. DFT calculation results showed that during the reaction between H 2 and the surface of CuO, Cu underwent a Cu 2+ → Cu 1+ → Cu 0 transformation, the Cu–O bond (−IpCOHP = 2.41) of the Cu 2 O phase was more stable than that (−IpCOHP = 1.94) of the CuO phase, and the reduction of Cu 2 O by H 2 was more difficult than the reduction of CuO. As the surface oxygen vacancy concentration increased, it was more likely that the subsurface O atoms transfer to the surface at zero H 2 coverage (no H 2 molecule on the surface), allowing the surface to maintain a stable Cu 2 O phase. However, when the H 2 coverage was 0.25 monolayer (ML) (one H 2 molecule every four surface Cu atoms), the presence of H atoms on the surface made the upward transfer of O atoms from the subsurface more difficult. The rate of consuming surface O atoms in the reduction reaction was greater than the rate of subsurface O atom transfer induced by the reduction reaction and the surface Cu 2 O phase could not be maintained stably. Through thermodynamic analysis, at high H 2 concentration, the reaction between H 2 and CuO was more likely to generate Cu, while at low H 2 concentration, it was more likely to generate Cu 2 O. In summary, the valence state of Cu in the reaction process between CuO and H 2 depended on the concentration of H 2 .
chemistry, multidisciplinary
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