Preparation of isotropic tensile photosensitive resins for digital light processing 3D printing using orthogonal thiol-ene and thiol-epoxy dual-cured strategies

Biao Yu,Jiaying Zheng,Jiazhen Wu,Hao Ma,Xiaoqin Zhou,Yonghai Hui,Fang Liu,Jingwei He
DOI: https://doi.org/10.1016/j.polymertesting.2022.107767
IF: 5.1
2022-12-01
Polymer Testing
Abstract:Poor layer interface adhesion leads to increasing anisotropic properties and weakening tensile properties of 3D printed parts. In order to reduce anisotropic properties and enhance the tensile properties of thiol-ene light-sensitive resins for Digital light processing (DLP) 3D printing, thiol-ene-epoxy hybrid resins containing a radical initiator (TPO) and photobase generator (TBD-HBPh4/ITX) were prepared to reduce the anisotropy and enhance the tensile properties of thiol-ene light-sensitive resins for digital light processing (DLP) 3D Printing. Real-time Fourier transform infrared spectroscopy (RT-FTIR) indicated that the CC bond conversion of resins exceeded 60%, and the thiol conversion was approximately 50%. The volumetric shrinkage of the thiol-ene resins increased to an extent with thermal treatment, indicating that these resins had undergone postcuring. Dynamic mechanical analysis showed that the glass temperature (Tg) increased from 20.8 °C to 34.1 °C. The tensile strength of the 3D printed part increased by approximately 500% with each printed orientation, and the degree of anisotropy with each orientation reduced by less than 5%. It was confirmed that the superior isotropic properties of the thiol-ene photosensitive resins for DLP 3D Printing were obtained using orthogonal thiol-ene and thiol-epoxy dual-curing strategies.
materials science, characterization & testing,polymer science
What problem does this paper attempt to address?