Abstract:Multilayer thermal conduction occurs commonly in engineering problems as varied as electronics cooling, nuclear engineering and bioheat transfer. A commonly found configuration is that of applying a thermal signal on a finite-thickness layer with a semi-infinite body underneath. In such a problem, the interest is in understanding the conditions in which the impact of the imposed thermal signal remains completely within the finite-thickness layer. Such information may be useful, for example, for designing nuclear plate-type fuel assemblies and thermoluminescence dosimeters, and guiding thermal-based therapies on skin to minimize collateral thermal damage to the deep tissue. For the special case of a single-layer body, this problem is governed by the well-known St. Venant's principle. The present work generalizes the thermal St. Venant's problem by accounting for the impact of the finite-thickness layer and interfacial thermal contact resistance. Temperature distribution in the two-layer body is derived as a function of parameters such as layer thickness, orthotropic thermal properties, interfacial thermal contact resistance and the mismatch in thermal conductivities of the two layers. Conditions in which the finite-thickness layer fully shields the semi-infinite body from the imposed thermal signal are derived. The impact of various non-dimensional parameters that represent the extent of orthotropy in the layers, interfacial thermal contact resistance and the relative thermal conductivities on the thermal shielding effect is investigated. Conditions under which thermal shielding is not particularly sensitive to some of these parameters are identified. Multiple representative problems related to bioheat transfer, nuclear reactors and thermoluminescence dosimeters are solved. In addition to generalizing the well-known St. Venant principle to a multilayer body, the present work may also aid in the thermal analysis and optimization of several practical multilayer problems.

Effective cross-plane thermal conductivity of metal-dielectric multilayers at low temperatures

Effective cross-plane thermal conductivity of metal-dielectric multilayers at low temperatures

Phonon dominated heat conduction normal to Mo/Si multilayers with period below 10 nm

Importance of Electron-Phonon Coupling in Thermal Transport in Metal/semiconductor Multilayer Films

Kinetic phenomena in metallic multilayers

Overcoming Limits to Near-Field Radiative Heat Transfer in Uniform Planar Media Through Multilayer Optimization.

Steady state and modulated heat conduction in layered systems predicted by the analytical solution of the phonon Boltzmann transport equation

Dissipation of boundary effects in multilayer heat conduction problems

In-plane Interfacial Phonon Transport Through Multi-Layer Thin Films by Theoretical Analyses and Monte Carlo Simulations

Cross-Plane Thermal Transport in Layered Materials

Heat transport in ultra-thin dielectric membranes and bridges

Manipulation of Effective Thermal Conductivity of Multilayer Thin Film by Varying Thickness Ratio of Layers Using Monte Carlo Simulation

Heat Conduction of Multilayer Nanostructures with Consideration of Coherent and Incoherent Phonon Transport

Anisotropic temperatures in multi-layered 2D materials

Role of the electron-phonon coupling in tuning the thermal boundary conductance at metal-dielectric interfaces by inserting ultrathin metal interlayers

Controlling the electron-phonon heat exchange in a metallic film by its position in a dielectric slab

Detailed consideration of the electron-phonon thermal conductance at metal-dielectric interfaces

Two-Dimensional Molecular Dynamics Simulation of the Thermal Conductance of Superlattices

Phonon heat removal from metal nano-particles and dynamics of nano-particle cooling at low temperatures

Interface Thermal Conductivities Induced by Van Der Waals Interactions

Analysis of Thermal Behavior in Multi-Layer Metal Thin Films Based on Hyperbolic Two-Step Model