Equilibrium Molecular Dynamics Study of Lattice Thermal Conductivity/Conductance of Au-SAM-Au Junctions

Tengfei Luo,John R. Lloyd
DOI: https://doi.org/10.48550/arXiv.0905.2008
2009-05-13
Abstract:In this paper, equilibrium molecular dynamics simulations were performed on Au-SAM (self-assembly monolayer)-Au junctions. The SAM consisted of alkanedithiol molecules. The out-of-plane (z-direction) thermal conductance and in-plane (x- and y-direction) thermal conductivities were calculated. Simulation finite size effect, gold substrate thickness effect, temperature effect, normal pressure effect, molecule chain length effect and molecule coverage effect on thermal conductivity/conductance were studied. Vibration power spectra of gold atoms in the substrate and sulfur atoms in the SAM were calculated and vibration coupling of these two parts was analyzed. The calculated thermal conductance values of Au-SAM-Au junctions are in the range of experimental data on metal-nonmetal junctions. The temperature dependence of thermal conductance has similar trend to experimental observations. It is concluded that the Au-SAM interface resistance dominates thermal energy transport across the junction, while the substrate is the dominant media in which in-plane thermal energy transport happens.
Mesoscale and Nanoscale Physics,Other Condensed Matter
What problem does this paper attempt to address?
The problem that this paper attempts to solve is to study the lattice thermal conductivity/thermal conductance of the gold - self - assembled monolayer - gold (Au - SAM - Au) junction. Specifically, the author explores the following problems through equilibrium molecular dynamics simulations: 1. **Thermal conductivity/thermal conductance in different directions**: The thermal conductivity/thermal conductance perpendicular to the plane (z - direction) and in - plane (x and y - directions) are calculated. 2. **Finite - size effect**: The influence of the size of the simulation system on the thermal conductivity is studied. 3. **Substrate thickness effect**: The influence of the thickness of the gold substrate on the thermal conductivity/thermal conductance is explored. 4. **Temperature effect**: The influence of temperature on the thermal conductivity/thermal conductance is studied. 5. **Positive pressure effect**: The influence of positive pressure on the thermal conductivity is analyzed. 6. **Molecular chain length effect**: The influence of the length of SAM molecular chains on the thermal conductivity is studied. 7. **Molecular coverage effect**: The influence of the coverage of SAM molecules on the gold substrate on the thermal conductivity is explored. In addition, the author also calculates the vibration power spectra of gold atoms in the substrate and sulfur atoms in the SAM, and analyzes the vibration coupling between these two parts. Finally, the author concludes that the Au - SAM interface resistance dominates the heat energy transfer across the junction, and the substrate is the main medium for in - plane heat energy transfer. ### Key problem summary - **Main objective**: Through molecular dynamics simulations, comprehensively understand the heat transfer characteristics of the Au - SAM - Au junction, especially the changes in thermal conductivity under different conditions. - **Application background**: This research is of great significance for heat management in fields such as molecular electronics and small - molecule organic thin - film transistors. ### Formulas involved The formulas involved in the paper include: - **Newton's second law**: \[ m\frac{d^{2}\mathbf{r}}{dt^{2}} = -\nabla\phi=\mathbf{F} \] - **Green - Kubo formula**: \[ k_{ij}=\frac{1}{Vk_{B}T}\int_{0}^{\infty}\langle J_{i}(t)J_{j}(0)\rangle dt \] where \(J_{i}(t)\) is the instantaneous heat flux, \(V\) is the volume of the simulation system, \(k_{B}\) is the Boltzmann constant, and \(T\) is the average temperature. These formulas are used to describe the heat transfer characteristics of the system and the relationships between physical quantities in molecular dynamics simulations.