Terahertz metamaterials on free-standing highly-flexible polyimide substrates

H. Tao,A. C. Strikwerda,K. Fan,C.M. Bingham,W. J. Padilla,X. Zhang,R. D. Averitt
DOI: https://doi.org/10.1088/0022-3727/41/23/232004
2008-08-04
Abstract:We have fabricated resonant terahertz metamaterials on free standing polyimide substrates. The low-loss polyimide substrates can be as thin as 5.5 micron yielding robust large-area metamaterials which are easily wrapped into cylinders with a radius of a few millimeters. Our results provide a path forward for creating multi-layer non-planar metamaterials at terahertz frequencies.
Materials Science
What problem does this paper attempt to address?
The paper attempts to address the problem of how to fabricate multilayer non-planar metamaterials at terahertz (THz) frequencies. Specifically, the authors explore methods for fabricating resonant terahertz metamaterials on free-standing, highly flexible polyimide substrates. These low-loss polyimide substrates can be as thin as 5.5 micrometers, allowing for the creation of large-area metamaterials that can be easily bent into cylindrical shapes with radii of a few millimeters. This research paves the way for the creation of multilayer non-planar metamaterials at terahertz frequencies, which is crucial for realizing complex electromagnetic composite structures such as cloaking devices, concentrators, or resonant absorbers. The paper mentions that as the frequency transitions from the microwave region to the visible light region, fabricating sub-wavelength unit structures becomes increasingly challenging. While some progress has been made in the microwave band, new manufacturing strategies still need to be developed in the terahertz band, especially for creating multi-unit structures along the propagation direction. By using polyimide as a material, researchers are able to overcome the limitations of traditional rigid substrates, achieving more flexible and thinner metamaterial designs, thereby providing new possibilities for future research and applications.