Interplay between grain boundary grooving, stress, and dealloying in the agglomeration of NiSi1-xGex films

H. B. Yao,M. Bouville,D. Z. Chi,H. P. Sun,X. Q. Pan,D. J. Srolovitz,D. Mangelinck
DOI: https://doi.org/10.1149/1.2400726
2006-05-18
Abstract:Germanosilicides, especially those formed on compressive substrates, are less stable than silicides against agglomeration. By studying the solid-state reaction of Ni thin film on strained Si0.8Ge0.2(001), we show that nickel germanosilicide is different from nickel silicide and nickel germanide in several respects: the grains are smaller and faceted, the groove angle is sharper, and dealloying takes place. The germanium out-diffusion creates a stress in the film which favors grooving and agglomeration.
Materials Science
What problem does this paper attempt to address?